Construction technology electronic components such as rapid development now. The past we still see so seize the place if we have the electronic equipment, but now we can keep in your pocket, like a Flash Disk, or phone. The phone now generally use BGA components, so that the more physically small so of course will not take place.
BGA IC technology is a technology that combines high performance, low cost, and reliability are the components with Ball Grid Array package (BGA) which provides high-speed solution logic (2GHz), bus transmission, fiber communications and high-frequency data rates achieved on 40 Gb / s, which is designed with RF and microwave processes used the wireless and wireline applications
. Many mobile phone manufacturers now have applied the BGA components on their production machines, such as the Power Amplifier IC, RF IC, IC PA, IC Flash / Memory, Accelerator; Camera, Radio, Bloethoot, etc.. Had a few blocks of a HP series can be combined into a single flip-chip BGA, will be something that is not possible a cell phone for hearing will be ead.Konstruksi BGA
Figure 1. BGA package construction, showing its relative simplicity and circuit
Side View Figure 2. Showing its PCB Side, Side and BGA Pin Count of BGA (2005) After handalnya a technology, if truth be told there is no manufacturer who can provide a lifetime warranty, and certainly not free from damage. Damage to components can result because the BGA ball pin corrosion, loose, porous, fire and others. As a corrective action can be done in several ways, depending on the condition of the damage. The first improvement is generally done by doing a reprint or core pin ball BGA IC with a specialized printing equipment and other repair equipment, and conduct re-appropriate installation procedures correctly.
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